该法案将为美国半导体研发、制造以及劳动力发展提供527亿美元。其中390亿美元将用于半导体制造业的激励措施，20亿美元用于汽车和国防系统使用的传统芯片。此外，在美国建立芯片工厂的企业将获得25%的减税。
拜登在法案签字仪式上说，尽管美国的芯片设计和研发保持领先，但全球只有10%的半导体是在美国本土生产。新冠疫情导致的供应链中断，推高了美国家庭和个人的成本。“我们需要在美国本土制造这些芯片，以降低日常成本，创造就业机会。”
拜登表示，这项法案将为美国整个半导体供应链提供资金，促进芯片产业用于研究和开发的关键投入。该法案要求任何接受美国政府资金的芯片企业必须在美国本土制造他们研发的技术。这意味着“在美国投资，在美国研发，在美国制造”。
CHIPS and Science Act of 2022
Sec. 101—Short title.
This Act may be cited as the “CHIPS Act of 2022.”
Sec. 102—Creating helpful incentives to produce semiconductors (CHIPS) for America fund.
In order to support the rapid implementation of the semiconductor provisions included in the Fiscal Year
(“FY”) 2021 National Defense Authorization Act (“NDAA”), this division would provide $52.7 billion in
emergency supplemental appropriations. The language would also re-affirm that the purchase of stocks
and dividends are not an eligible use of CHIPS funds as determined by the eligible use of funds already
required under the FY21 NDAA.
Funded activities include:
$50.0 billion allocated over 5 years for a CHIPS for America Fund. Funding must be used to
implement the Commerce Department semiconductor incentive—to develop domestic
manufacturing capability—and research and development (“R&D”) and workforce development
programs authorized by the FY21 NDAA (Sec. 9902 & 9906). Each fiscal year, up to 2 percent of
funds are made available for salaries and expenses, administration, and oversight, of which $5
million is available each year for the inspector general.
Within the fund, the following appropriations are available:
o Incentive Program: $39 billion allocated over 5 years to implement the programs
authorized in Sec. 9902, of which $2 billion is explicitly provided to focus solely on
legacy chip production to advance economic and national security interests. These chips
are essential to the auto industry, the military, and other critical industries. Within the
incentive program, up to $6 billion may be used for the cost of direct loans and loan
guarantees.
$19 billion in FY22, including the $2 billion legacy chip production funding.
$5 billion each year, FY23 through FY26
o Commerce R&D and workforce development programs: $11 billion appropriated over 5
years to implement programs authorized in Sec. 9906, including the National
Semiconductor Technology Center (“NSTC”), the National Advanced Packaging
Manufacturing Program, and other R&D and workforce development programs
authorized in Sec. 9906.
$5 billion in FY22
$2 billion for NSTC
$2.5 billion for advanced packaging
$500 million for other related R&D programs
For use across the NSTC, advanced packaging, and other related R&D programs,
the following would be provided:
$2 billion in FY23
$1.3 billion in FY24
$1.1 billion in FY25
$1.6 billion in FY26
$2 billion for a CHIPS for America Defense Fund: Funding would be appropriated for the
Microelectronics Commons, a national network for onshore, university-based prototyping, lab-tofab transition of semiconductor technologies—including Department of Defense-unique
applications—and semiconductor workforce training.
